| Title: |
Process Integration for 300-nm-Pitch Hybrid Bonding with SiCN: 50nm Bonding Overlay, Fine-Grain Cu Metallurgy, and Reliability Assessment |
| Authors: |
Ma, Kai; Bekiaris, Nikolaos; Chen, Jingting Nicole; Xu, Jing; Dai, Huixiong; Haimberger, Jakob; Goldberger, David; Probst, Gernot; Uhrmann, Thomas; Wimplinger, Markus |
| Source: |
2026 IEEE 76th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2026 IEEE 76th. :1132-1138 May, 2026 |
| Relation: |
2026 IEEE 76th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |