Novel Photosensitive Material with Low Shrinkage and Low Dielectric properties for High-Density RDL in Glass Packaging
| Title: | Novel Photosensitive Material with Low Shrinkage and Low Dielectric properties for High-Density RDL in Glass Packaging |
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| Authors: | Kawasaki, Ritsuya; Nakashima, Kazuya; Lin, Yu-Chieh; Park, Hyunggyu; Moon, Kyoung-Sik; Kathaperumal, Mohanalingam; Wong, Ching-Ping |
| Source: | 2026 IEEE 76th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2026 IEEE 76th. :1164-1168 May, 2026 |
| Relation: | 2026 IEEE 76th Electronic Components and Technology Conference (ECTC) |
| Database: | IEEE Xplore Digital Library |