| Title: |
Experimental Characterization of Thermal Transport in Cu/Sn–Diamond Microbumps |
| Authors: |
Wang, Keyu; Chen, Zhengwei; Tavkari, Devang; Kyatam, Shusmitha; Li, Jie; Opendo, Noah; Mendes, Joana Catarina; Neto, Miguel A.; Marconnet, Amy M.; Wei, Tiwei |
| Source: |
2026 IEEE 76th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2026 IEEE 76th. :1286-1293 May, 2026 |
| Relation: |
2026 IEEE 76th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |