| Title: |
Hierarchical 3D-Vertically staking with Multi-layer and Stacking with Novel Structure by Transferrable Cu/polymer Hybrid Bonding and 3D-Vertically Stacking For High speed Digital Applications |
| Authors: |
Lee, Ou-Hsiang; Chan, Yu-Ping; Chiu, Wei-Lan; Chang, Hsiang-Hung; Chiang, Chia-Wen; Peng, Jr-Wei; Chen, Meng-Hsuan; Chen, Kuan-Neng; Lin, Jia-Rui; Chang, Liang-Cyuan; Fan, Jia-Wen; Chien, Da-Cheng; OuYang, Tsung-Yu; Wang, Chin-Hung; Lo, Wei-Chung; Lee, Chia-Hsin; Tan, Chung-An; Chang, Shih-Chieh |
| Source: |
2026 IEEE 76th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2026 IEEE 76th. :2035-2041 May, 2026 |
| Relation: |
2026 IEEE 76th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |