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Sirius: A Dual-Chiplet System for Multimodal Embodied AI with Heterogeneous RVV Cores, Dense and Sparse Accelerators

Title: Sirius: A Dual-Chiplet System for Multimodal Embodied AI with Heterogeneous RVV Cores, Dense and Sparse Accelerators
Authors: Jain, Vikram; Genc, Hasan Nazim; Hooper, Coleman; Nguyen, Minh; Kumar, Rahul; Kumar, Rohan; Wang, Di; Anderson, Kevin; Chi, Yufeng; Dong, Shengjun Kris; Nikiforov, Dima; Zhou, Bob; Nikolic, Borivoje; Shao, Yakun Sophia
Source: 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2026 IEEE/JSAP Symposium on. :1-3 Jun, 2026
Relation: 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
Database: IEEE Xplore Digital Library