| Title: |
A Multi-Stacked Cell Array Architecture with Wafer-to-Wafer Cu Direct Bonding for Ultra-High-Density 3D Flash Memory Beyond 1,000 Word Lines |
| Authors: |
Noda, Mitsuhiko; Hashimoto, Susumu; Mizumoto, Ryuta; Watanabe, Mamoru; Sawada, Genki; Kawasaki, Kanta; Sonoda, Masahisa; Kamiya, Eiji; Morooka, Tetsu; Nakatsuka, Keisuke; Maejima, Hiroshi; Kobayashi, Shigeki; Suzuki, Shinji; Sakotsubo, Yukihiro; Osawa, Kohei; Sato, Shinya; Shibasaki, Teiji; Yaegashi, Masahiro; Honma, Ryoichi; Tagami, Masayoshi; Sekine, Katsuyuki |
| Source: |
2026 IEEE/JSAP Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2026 IEEE/JSAP Symposium on. :1-3 Jun, 2026 |
| Relation: |
2026 IEEE/JSAP Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) |
| Database: |
IEEE Xplore Digital Library |