Power Integrity in 3-D Chiplet Systems with Intermediate Layers
| Title: | Power Integrity in 3-D Chiplet Systems with Intermediate Layers |
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| Authors: | Ayes, Andres; Friedman, Eby G. |
| Source: | 2026 IEEE 30th Workshop on Signal and Power Integrity (SPI) Signal and Power Integrity (SPI), 2026 IEEE 30th Workshop on. 1:1-4 Jun, 2026 |
| Relation: | 2026 IEEE 30th Workshop on Signal and Power Integrity (SPI) |
| Database: | IEEE Xplore Digital Library |