| Title: |
Low temperature snap cure thermoset adhesives with good worklife |
| Authors: |
Gillissen, S.; Nelis, E.; van Wuytswinkel, G.; de Pater, M.; Chih-Min Cheng; Buffa, V.; O'Hara, W.; Bo Xia; Jayesh Shah |
| Source: |
Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Polymers and Adhesives in Microelectronics and Photonics, Polytronic, 2005. Polytronic 2005. 5th International Conference on. :166-170 2005 |
| Relation: |
2005 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics |
| Database: |
IEEE Xplore Digital Library |