Conformance of ECD wafer bumping to future demands on CSP, 3D integration, and MEMS
| Title: | Conformance of ECD wafer bumping to future demands on CSP, 3D integration, and MEMS |
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| Authors: | Dietrich, L.; Toepper, M.; Ehrmann, O.; Reichl, H. |
| Source: | 56th Electronic Components and Technology Conference 2006 Electronic Components & Technology Electronic Components and Technology Conference, 2006. Proceedings. 56th. :10 pp. 2006 |
| Relation: | 2006 Proceedings. 56th Electronic Components & Technology Conference |
| Database: | IEEE Xplore Digital Library |