| Title: |
45 nm Node Multi Level Interconnects with Porous SiOCH Dielectric k=2.5 |
| Authors: |
Arnal, V.; Farcy, A.; Aimadeddine, M.; Icard, B.; Guedj, C.; Maitrejean, S.; Todeschini, J.; Besling, W.; Brun, P.; Ollier, E.; Jacquemin, J.P.; Delsol, R.; Vannier, P.; Mellier, M.; Richard, E.; Fox, R.; Imbert, G.; Lefriec, Y.; Toffoli, A.; Torres, J. |
| Source: |
2006 International Interconnect Technology Conference Interconnect Technology Conference, 2006 International. :213-215 2006 |
| Relation: |
2006 International Interconnect Technology Conference |
| Database: |
IEEE Xplore Digital Library |