Wafer Bonding with BCB and SU-8 for MEMS Packaging
| Title: | Wafer Bonding with BCB and SU-8 for MEMS Packaging |
|---|---|
| Authors: | Maik Wiemer; Chenping Jia; Toepper, M.; Hauck, K. |
| Source: | 2006 1st Electronic Systemintegration Technology Conference Electronics Systemintegration Technology Conference, 2006. 1st. 2:1401-1405 Sep, 2006 |
| Relation: | 2006 1st Electronic Systemintegration Technology Conference |
| Database: | IEEE Xplore Digital Library |