Vertical Differential Pair Routing in High Performance Ceramic Multi-chip Module Packages
| Title: | Vertical Differential Pair Routing in High Performance Ceramic Multi-chip Module Packages |
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| Authors: | Baez, Franklin; Van Dyke, Peter; Spring, Christopher |
| Source: | 2007 IEEE Electrical Performance of Electronic Packaging Electrical Performance of Electronic Packaging, 2007 IEEE. :227-230 Oct, 2007 |
| Relation: | 2007 IEEE Electrical Performance of Electronic Packaging |
| Database: | IEEE Xplore Digital Library |