Copper / Benzocyclobutene Multi Layer Wiring - A flexible base Technology for Wafer Level Integration of passive Components
| Title: | Copper / Benzocyclobutene Multi Layer Wiring - A flexible base Technology for Wafer Level Integration of passive Components |
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| Authors: | Zoschke, K.; Wolf, J.; Ehrmann, O.; Toepper, M.; Reichl, H. |
| Source: | 2007 9th Electronics Packaging Technology Conference Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th. :295-302 Dec, 2007 |
| Relation: | 2007 9th Electronics Packaging Technology Conference |
| Database: | IEEE Xplore Digital Library |