Through silicon vias as enablers for 3D systems
| Title: | Through silicon vias as enablers for 3D systems |
|---|---|
| Authors: | Jung, Erik; Ostmann, A.; Ramm, P.; Wolf, J.; Toepper, M.; Wiemer, M. |
| Source: | 2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS Design, Test, Integration and Packaging of MEMS/MOEMS, 2008. MEMS/MOEMS 2008. Symposium on. :119-122 Apr, 2008 |
| Relation: | 2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (MEMS/MOEMS) |
| Database: | IEEE Xplore Digital Library |