| Title: |
Development of a 65nm Cu/low-k Stack Die FBGA Package for SiP Applications |
| Authors: |
Zhang, Xiaowu; Premachandran, C. S.; Chong, Ser-Choong; Wai, Leong Ching; Lee, Vincent; Chai, TC; Kripesh, V.; Lau, John H.; Sekhar, V.K.; Wang, Sandy; Pinjala, D.; Lee, Charles; Yeow, Siao Lin |
| Source: |
2008 10th Electronics Packaging Technology Conference Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th. :379-386 Dec, 2008 |
| Relation: |
2008 10th Electronics Packaging Technology Conference (EPTC) |
| Database: |
IEEE Xplore Digital Library |