Wafer Level Hermetic Bonding Using Sn/In and Cu/Ti/Au Metallization
| Title: | Wafer Level Hermetic Bonding Using Sn/In and Cu/Ti/Au Metallization |
|---|---|
| Authors: | Yu, Daquan; Yan, Liling; Lee, Chengkuo; Choi, Won Kyoung; Thew, Meei Ling; Fool, Chin Keng; Lau, John H |
| Source: | 2008 10th Electronics Packaging Technology Conference Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th. :767-772 Dec, 2008 |
| Relation: | 2008 10th Electronics Packaging Technology Conference (EPTC) |
| Database: | IEEE Xplore Digital Library |