Temporary adhesives for wafer bonding: Deep reactive ion etching application
| Title: | Temporary adhesives for wafer bonding: Deep reactive ion etching application |
|---|---|
| Authors: | Belharet, Djaffar; Dubreuil, Pascal; Colin, David; Mazenq, Laurent; Granier, Hugues |
| Source: | 2009 European Microelectronics and Packaging Conference Microelectronics and Packaging Conference, 2009. EMPC 2009. European. :1-7 Jun, 2009 |
| Relation: | 2009 European Microelectronics and Packaging Conference (EMPC) |
| Database: | IEEE Xplore Digital Library |