Encapsulation challenges for wafer level packaging
| Title: | Encapsulation challenges for wafer level packaging |
|---|---|
| Authors: | Kuah, TH Eric; Hao, JY; Ding, JP; Li, QF; Chan, WL; Ho, SC; Huang, HM; Jiang, YJ |
| Source: | 2009 European Microelectronics and Packaging Conference Microelectronics and Packaging Conference, 2009. EMPC 2009. European. :1-6 Jun, 2009 |
| Relation: | 2009 European Microelectronics and Packaging Conference (EMPC) |
| Database: | IEEE Xplore Digital Library |