3-D thin chip integration technology - from technology development to application
| Title: | 3-D thin chip integration technology - from technology development to application |
|---|---|
| Authors: | Fritzsch, T.; Mrossko, R.; Baumgartner, T.; Toepper, M.; Klein, M.; Wolf, J.; Wunderle, B.; Reichl, H. |
| Source: | 2009 IEEE International Conference on 3D System Integration 3D System Integration, 2009. 3DIC 2009. IEEE International Conference on. :1-8 Sep, 2009 |
| Relation: | 2009 IEEE International Conference on 3D System Integration (3DIC) |
| Database: | IEEE Xplore Digital Library |