Understanding the Correlation Between Intermetallic Growth, Stress Evolution, and Sn Whisker Nucleation
| Title: | Understanding the Correlation Between Intermetallic Growth, Stress Evolution, and Sn Whisker Nucleation |
|---|---|
| Authors: | Jadhav, N.; Buchovecky, E. J.; Reinbold, L.; Kumar, S.; Bower, A. F.; Chason, E. |
| Source: | IEEE Transactions on Electronics Packaging Manufacturing IEEE Trans. Electron. Packag. Manufact. Electronics Packaging Manufacturing, IEEE Transactions on. 33(3):183-192 Jul, 2010 |
| Database: | IEEE Xplore Digital Library |