Wafer-level glass capping with optical integration
| Title: | Wafer-level glass capping with optical integration |
|---|---|
| Authors: | Hansen, U.; Maus, S.; Leib, J.; Toepper, M. |
| Source: | 2010 Symposium on Design Test Integration and Packaging of MEMS/MOEMS (DTIP) Design Test Integration and Packaging of MEMS/MOEMS (DTIP), 2010 Symposium on. :237-241 May, 2010 |
| Relation: | 2010 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) |
| Database: | IEEE Xplore Digital Library |