| Title: |
Development and characterisation of a 3D technology including TSV and Cu pillars for high frequency applications |
| Authors: |
Charbonnier, J.; Hida, R.; Henry, D.; Cheramy, S.; Chausse, P.; Neyret, M.; Hajji, O.; Garnier, G.; Brunet-Manquat, C.; Haumesser, P. H.; Vandroux, L.; Anciant, R.; Sillon, N.; Farcy, A.; Rousseau, M.; Cuzzocrea, J.; Druais, G.; Saugier, E. |
| Source: |
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th. :1077-1082 Jun, 2010 |
| Relation: |
2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010) |
| Database: |
IEEE Xplore Digital Library |