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Recent advances in submicron alignment 300 mm copper-copper thermocompressive face-to-face wafer-to-wafer bonding and integrated infrared, high-speed FIB metrology

Title:	Recent advances in submicron alignment 300 mm copper-copper thermocompressive face-to-face wafer-to-wafer bonding and integrated infrared, high-speed FIB metrology
Authors:	Teh, W.H.; Deeb, C.; Burggraf, J.; Wimplinger, M.; Matthias, T.; Young, R.; Senowitz, C.; Buxbaum, A.
Source:	2010 IEEE International Interconnect Technology Conference Interconnect Technology Conference (IITC), 2010 International. :1-3 Jun, 2010
Relation:	2010 IEEE International Interconnect Technology Conference - IITC
Database:	IEEE Xplore Digital Library