| Title: |
AC operation of high performance glass ceramic package interconnect and impact on manufacturing |
| Authors: |
Baez, Franklin M.; Spring, Christopher; Lafontant, Gary |
| Source: |
19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems Electrical Performance of Electronic Packaging and Systems (EPEPS), 2010 IEEE 19th Conference on. :261-264 Oct, 2010 |
| Relation: |
2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) |
| Database: |
IEEE Xplore Digital Library |