Thin wafer processing and chip stacking for 3D integration
| Title: | Thin wafer processing and chip stacking for 3D integration |
|---|---|
| Authors: | Matthias, T.; Kim, B.; Wimplinger, M.; Lindner, P. |
| Source: | 3rd Electronics System Integration Technology Conference ESTC Electronic System-Integration Technology Conference (ESTC), 2010 3rd. :1-6 Sep, 2010 |
| Relation: | 2010 3rd Electronic System-Integration Technology Conference (ESTC) |
| Database: | IEEE Xplore Digital Library |