| Title: |
Copper-oxide reduction for low-temperature wafer bonding |
| Authors: |
Rebhan, B.; Tollabimazraehno, S.; Plach, T.; Hesser, G.; Burggraf, J.; Mittendorfer, G.; Dragoi, V.; Wimplinger, M.; Hingerl, K. |
| Source: |
2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on. :53-53 May, 2012 |
| Relation: |
2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) |
| Database: |
IEEE Xplore Digital Library |