Low temperature plasma activated direct wafer bonding
| Title: | Low temperature plasma activated direct wafer bonding |
|---|---|
| Authors: | Plach, T.; Hingerl, K.; Dragoi, V.; Wimplinger, M. |
| Source: | 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on. :145-145 May, 2012 |
| Relation: | 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) |
| Database: | IEEE Xplore Digital Library |