| Title: |
Evaluation of 3D interconnect routing and stacking strategy to optimize high speed signal transmission for memory on logic |
| Authors: |
Roullard, J.; Farcy, A.; Capraro, S.; Lacrevaz, T.; Bermond, C.; Houzet, G.; Charbonnier, J.; Fuchs, C.; Ferrandon, C.; Leduc, P.; Flechet, B. |
| Source: |
2012 IEEE 62nd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd. :8-13 May, 2012 |
| Relation: |
2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |