| Title: |
Electrical and morphological assessment of via middle and backside process technology for 3D integration |
| Authors: |
Colonna, Jean-Philippe; Coudrain, Perceval; Garnier, Gennie; Chausse, Pascal; Segaud, Roselyne; Aumont, Christophe; Jouve, Amandine; Hotellier, Nicolas; Frank, Thomas; Brunet-Manquat, Catherine; Cheramy, Severine; Sillon, Nicolas |
| Source: |
2012 IEEE 62nd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd. :796-802 May, 2012 |
| Relation: |
2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |