| Title: |
Refined but handy electrical models of TSV usable from low to high density and for RF or fast digital signals in 3D-IC |
| Authors: |
Fourneaud, L.; Lacrevaz, T.; Bermond, C.; Charbonnier, J.; Fuchs, C.; Farcy, A.; Gaeremynck, Y.; Flechet, B. |
| Source: |
2012 IEEE 62nd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd. :1858-1865 May, 2012 |
| Relation: |
2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |