| Title: |
Microstructure comparative analysis of the solder joints based on SAC/SN100 soldering alloy type depending on the cooling rate |
| Authors: |
Plotog, I.; Dumitru, G.; Codreanu, N. D.; Vasile, A.; Branzei, M.; Pencea, I.; Tarcolea, M. |
| Source: |
2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2012 IEEE 18th International Symposium for. :167-172 Oct, 2012 |
| Relation: |
2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) |
| Database: |
IEEE Xplore Digital Library |