| Title: |
Laboratory platform for board temperature profiling inside reflow ovens |
| Authors: |
Vidrascu, M.; Codreanu, N. D.; Lecu, R.; Plotog, I. |
| Source: |
2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2012 IEEE 18th International Symposium for. :201-204 Oct, 2012 |
| Relation: |
2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) |
| Database: |
IEEE Xplore Digital Library |