| Title: |
Packaging and modular assembly of large-area and fine-pitch 2-D ultrasonic transducer arrays |
| Authors: |
Lin, D.-S.; Wodnicki, R.; Zhuang, X.; Woychik, C.; Thomenius, K.E.; Fisher, R.A.; Mills, D.M.; Byun, A.J.; Burdick, W.; Khuri-Yakub, P.; Bonitz, B.; Davies, T.; Thomas, G.; Otto, B.; Töpper, M.; Fritzsch, T.; Ehrmann, O. |
| Source: |
IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control IEEE Trans. Ultrason., Ferroelect., Freq. Contr. Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on. 60(7):1356-1375 Jul, 2013 |
| Database: |
IEEE Xplore Digital Library |