Wafer level packaging for ultra thin (6 μm) high brightness LEDs using embedding technology
| Title: | Wafer level packaging for ultra thin (6 μm) high brightness LEDs using embedding technology |
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| Authors: | Kleff, J.; Topper, M.; Dietrich, L.; Oppermann, H.; Herrmann, S. |
| Source: | 2013 IEEE 63rd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd. :1219-1224 May, 2013 |
| Relation: | 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) |
| Database: | IEEE Xplore Digital Library |