| Title: |
Test and debug strategy for TSMC CoWoS™ stacking process based heterogeneous 3D IC: A silicon case study |
| Authors: |
Goel, Sandeep Kumar; Adham, Saman; Wang, Min-Jer; Chen, Ji-Jan; Huang, Tze-Chiang; Mehta, Ashok; Lee, Frank; Chickermane, Vivek; Keller, Brion; Valind, Thomas; Mukherjee, Subhasish; Sood, Navdeep; Cho, Jeongho; Lee, Hayden Hyungdong; Choi, Jungi; Kim, Sangdoo |
| Source: |
2013 IEEE International Test Conference (ITC) Test Conference (ITC), 2013 IEEE International. :1-10 Sep, 2013 |
| Relation: |
2013 IEEE International Test Conference (ITC) |
| Database: |
IEEE Xplore Digital Library |