| Title: |
Double-sided cooling and thermo-electrical management of power transients for silicon chips on DCB-substrates for converter applications: Design, technology and test |
| Authors: |
Wunderle, B.; Manier, C.-A.; Ras, M. Abo; Springborn, M.; May, D.; Oppermann, H.; Toepper, M.; Mrossko, R.; Xhonneux, T.; Caroff, T.; Maurer, W.; Mitova, R. |
| Source: |
19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2013 19th International Workshop on. :253-261 Sep, 2013 |
| Relation: |
2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) |
| Database: |
IEEE Xplore Digital Library |