| Title: |
Thin wafer handling and chip to wafer stacking technologies |
| Authors: |
Pauzenberger, Gunter; Uhrmann, Thomas; Wimplinger, Markus; Matthias, Thorsten; Su, Kevin; Tsai, TseMin |
| Source: |
2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013 8th International. :59-62 Oct, 2013 |
| Relation: |
2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
| Database: |
IEEE Xplore Digital Library |