| Title: |
Results of tests of three-dimensionally integrated chips bonded to sensors |
| Authors: |
Deptuch, Grzegorz W.; Carini, Gabriella; Collier, Terence; Grybos, Pawel; Kmon, Piotr; Lipton, Ronald; Maj, Piotr; Trimpl, Marcel; Siddons, David P.; Szczygiel, Robert; Yarema, Raymond |
| Source: |
2013 IEEE Nuclear Science Symposium and Medical Imaging Conference (2013 NSS/MIC) Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC), 2013 IEEE. :1-5 Oct, 2013 |
| Relation: |
2013 IEEE Nuclear Science Symposium and Medical Imaging Conference (2013 NSS/MIC) |
| Database: |
IEEE Xplore Digital Library |