Versatile thin wafer stacking technology for monolithic integration of temporary bonded thin wafers
| Title: | Versatile thin wafer stacking technology for monolithic integration of temporary bonded thin wafers |
|---|---|
| Authors: | Uhrmann, Thomas; Burggraf, Jurgen; Bravin, Julian; Dragoi, Viorel; Wimplinger, Markus; Matthias, Thorsten; Lindner, Paul |
| Source: | 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. :888-893 May, 2014 |
| Relation: | 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) |
| Database: | IEEE Xplore Digital Library |