Electrical performance of isotropic conductive adhesives with copper and copper coated iron fillers
| Title: | Electrical performance of isotropic conductive adhesives with copper and copper coated iron fillers |
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| Authors: | Liu, Junpeng; Redei, Richard; Qi, Siyuan; Hutt, David A.; Whalley, David |
| Source: | 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th. :531-535 Dec, 2014 |
| Relation: | 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) |
| Database: | IEEE Xplore Digital Library |