| Title: |
Development of Chip-on-Wafer (CoW) stacked chip packaging for high-end CIS application |
| Authors: |
Ni, Tom; Lien, Lisa; Chen, Nuno; Huang, KY; Chang, Winson; Chung, KW; Huang, Wesley; Wang, Roger; Chen, MJ; Liu, Alex; Hsu, SC; Lin, James; Chang, CC; Tai, Johnson |
| Source: |
2015 IEEE 65th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th. :555-559 May, 2015 |
| Relation: |
2015 IEEE 65th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |