Influencing factors in high precision fusion wafer bonding for monolithic integration
| Title: | Influencing factors in high precision fusion wafer bonding for monolithic integration |
|---|---|
| Authors: | Uhrmann, Thomas; Kurz, Florian; Plach, Thomas; Wagenleitner, Thomas; Dragoi, Viorel; Wimplinger, Markus; Lindner, Paul |
| Source: | 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th. :906-909 May, 2015 |
| Relation: | 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) |
| Database: | IEEE Xplore Digital Library |