| Title: |
Effect of the temperature on the strain distribution induced in silicon interposer by TSVs: A comparison between micro-Laue and monochromatic nanodiffraction |
| Authors: |
Vianne, B.; Krauss, C.; Escoubas, S.; Richard, M.-I.; Labaf, S.; Chahine, G.; Schullli, T.; Micha, J.-S.; Fiori, V.; Farcy, A.; Thomas, O. |
| Source: |
2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM), 2015 IEEE International. :59-62 May, 2015 |
| Relation: |
2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) |
| Database: |
IEEE Xplore Digital Library |