| Title: |
Transient thermal management by using double-sided assembling, thermo-electric cooling and phase-change based thermal buffer structures: Design, technology and application |
| Authors: |
Springborn, M.; Wunderle, B.; May, D.; Mrossko, R.; Manier, C.-A.; Ras, M. Abo; Oppermann, H.; Xhonneux, T.; Caroff, T.; Mitova, R. |
| Source: |
2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2015 21st International Workshop on. :1-7 Sep, 2015 |
| Relation: |
2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) |
| Database: |
IEEE Xplore Digital Library |