| Title: |
Investigations on power cycling induced fatigue failure of IGBTs with silver sinterea interconnects |
| Authors: |
Dudek, R.; Doring, R.; Rzepka, S.; Ehrhardt, C.; Hutter, M.; Rudzki, J.; Osterwald, F.; Eisele, R.; Stegmeier, S.; Weidner, K.; Rittner, M. |
| Source: |
2015 European Microelectronics Packaging Conference (EMPC) Microelectronics Packaging Conference (EMPC), 2015 European. :1-8 Sep, 2015 |
| Relation: |
2015 European Microelectronics Packaging Conference (EMPC) |
| Database: |
IEEE Xplore Digital Library |