Insulation Issues in Punch-Through Biased Silicon Microstrip Sensors
| Title: | Insulation Issues in Punch-Through Biased Silicon Microstrip Sensors |
|---|---|
| Authors: | Giacomini, G.; Bosisio, L.; Rashevskaya, I. |
| Source: | IEEE Transactions on Nuclear Science IEEE Trans. Nucl. Sci. Nuclear Science, IEEE Transactions on. 63(1):422-426 Feb, 2016 |
| Database: | IEEE Xplore Digital Library |