| Title: |
Material and process trends for moving from FOWLP to FOPLP |
| Authors: |
Braun, T.; Voges, S.; Topper, M.; Wilke, M.; Wohrmann, M.; Maas, U.; Huhn, M.; Becker, K.-F.; Raatz, S.; Kim, J.-U.; Aschenbrenner, R.; Lang, K.-D.; O'Connor, C.; Barr, R.; Calvert, J.; Gallagher, M.; Iagodkine, E.; Aoude, T.; Politis, A. |
| Source: |
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th. :1-6 Dec, 2015 |
| Relation: |
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) |
| Database: |
IEEE Xplore Digital Library |