Heterogeneous integration through direct wafer bonding
| Title: | Heterogeneous integration through direct wafer bonding |
|---|---|
| Authors: | Eibelhuber, M.; Razek, N.; Dragoi, V.; Flotgen, C.; Wimplinger, M.; Uhrmann, T. |
| Source: | 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th. :1-2 Dec, 2015 |
| Relation: | 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) |
| Database: | IEEE Xplore Digital Library |