Enabling Cu wire in 3D stack package QFN
| Title: | Enabling Cu wire in 3D stack package QFN |
|---|---|
| Authors: | Camenforte, Ruby Ann M.; de Asis, Ray Fredric; Chowdhury, Mahmud |
| Source: | 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th. :1-7 Dec, 2015 |
| Relation: | 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) |
| Database: | IEEE Xplore Digital Library |