| Title: |
Opportunities of Fan-out Wafer Level Packaging (FOWLP) for RF applications |
| Authors: |
Braun, T.; Topper, M.; Becker, K.-F.; Wilke, M.; Huhn, M.; Maass, U.; Ndip, I.; Aschenbrenner, R.; Lang, K.-D. |
| Source: |
2016 IEEE 16th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) Silicon Monolithic Integrated Circuits in RF Systems (SiRF), 2016 IEEE 16th Topical Meeting on. :35-37 Jan, 2016 |
| Relation: |
2016 IEEE 16th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) |
| Database: |
IEEE Xplore Digital Library |